h5-index is the h-index for articles published in the last 5 complete years. It is the largest number h such that h articles published in 2014-2018 have at least h citations each.hide
h5-median for a publication is the median number of citations for the articles that make up its h5-index.hide
| Publication | h5-index | h5-median | |
|---|---|---|---|
| 1. | IEEE Transactions on Electron Devices | 56 | 66 |
| 2. | IEEE Electron Device Letters | 53 | 69 |
| 3. | IEEE International Electron Devices Meeting, IEDM | 44 | 62 |
| 4. | Electronics Letters | 39 | 50 |
| 5. | Microelectronic Engineering | 34 | 46 |
| 6. | Microelectronics Reliability | 32 | 42 |
| 7. | IEEE Transactions on Components, Packaging and Manufacturing Technology | 30 | 37 |
| 8. | IEEE/MTT-S International Microwave Symposium | 28 | 38 |
| 9. | Microelectronics Journal | 28 | 36 |
| 10. | IEEE Symposium on VLSI Technology | 27 | 46 |
| 11. | IEEE Electronic Components and Technology Conference (ECTC) | 26 | 32 |
| 12. | Solid-State Electronics | 26 | 32 |
| 13. | IEEE Transactions on Device and Materials Reliability | 25 | 37 |
| 14. | Microwave and Optical Technology Letters | 25 | 31 |
| 15. | IEEE International Reliability Physics Symposium (IRPS) | 24 | 30 |
| 16. | IEEE Journal of the Electron Devices Society | 23 | 37 |
| 17. | IEEE International Symposium on Power Semiconductor Devices & IC's (ISPSD) | 23 | 32 |
| 18. | European Solid State Circuits Conference (ESSCIRC) | 22 | 32 |
| 19. | Journal of Electronic Packaging | 21 | 35 |
| 20. | Symposium on VLSI Circuits | 21 | 30 |
Dates and citation counts are estimated and are determined automatically by a computer program.